Submission GuidelinesA submission must be a single PDF file conforming to the ACM SIGPLAN Conference Format and must not exceed 6 pages (including abstract, figures, tables, and appendices, but excluding references). Submissions must be in English. Submissions that do not adhere to these guidelines or that violate formatting will be declined without review. Reviewing is single-blind; papers must include author names and affiliations. Authors are required to add “(industry track)” at the end of their paper title.
Each submission will be reviewed by at least three members of the Industrial Track Program Committee. Submissions will be evaluated on the basis of originality, importance of contribution, technical soundness, evaluation, quality of presentation and appropriate comparison to related work. The committee as a whole will make final decisions about which submissions to accept for presentation at the conference.
Simultaneous submission of the same work to multiple venues, submission of previously published work, or plagiarism constitutes dishonesty or fraud. The conference organizers, like those of other scientific conferences and journals, prohibit these practices and may take actions against authors who have committed them. Papers accompanied by nondisclosure agreement forms will not be considered. If you are uncertain whether your submission meets the guidelines, please contact the program co-chairs.
By submitting a paper, you agree that at least one of the authors will attend the conference and present the paper in person.
General chair
Guillaume Pierre, Univ. Rennes, France
Program Chairs
Lydia Y. Chen, IBM Research, Switzerland
Erwan Le Merrer, Technicolor R&I, France
Program Committee
Robert Birke, ABB Corporate Research, Switzerland
Daniele Bonetta, Oracle, USA
Antoine Boutet, INSA-Lyon, France
Ruichuan Chen, Bell Labs, Germany
Paolo Costa, Microsoft Research, UK
Thierry Coupaye, Orange Labs, France
Ioana Giurgiu, IBM, Switzerland
Vincent Gramoli, NICTA/Data61-CSIRO and University of Sydney, Australia
Yuxiong He, Microsoft Research, USA
Nicolas Le Scouarnec, Technicolor, France
Padmanabhan Pillai, Intel Labs, USA
Jan Rellermeyer, TU Delft, Nederlands
Christopher Stewart, Ohio State University, USA
Maja Vukovic, IBM, USA
Chen Wang, VMWare, USA
Xiaoyun Zhu, HyperPilot, USA